Abrading – Flexible-member tool – per se
Reexamination Certificate
2007-08-28
2007-08-28
Ackun, Jr., Jacob K. (Department: 3723)
Abrading
Flexible-member tool, per se
Reexamination Certificate
active
11050722
ABSTRACT:
A single-layered polishing pad suitable for chemical mechanical polishing (CMP) of semiconductor wafers, etc., which attains excellent step height reduction and in-plane uniformity and is integrally molded by reaction injection molding, is provided. The polishing pad is a polyurethane-based foam12having a desired shape, as obtained by molding a gas-dissolved raw material having an inert gas dissolved under pressure in a polyurethane-base resin raw material by a reaction injection molding method, and includes a polishing region14having a polishing surface14asuitable for polishing semi-conductor materials, etc. and having a Shore D hardness in the range of from 40 to 80 and a stress reduction region16which is present in the side opposing to the polishing surface14aand which, when provided with a stress adjusting portion22of a desired pattern, is set up so as to have an amount of deflection, as applied with a load of 0.05 MPa, of 10 μm or more.
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Ackun Jr. Jacob K.
Inoac Corporation
Rogers Inoac Corporation
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