Polishing pad

Details Polishing pad Polishing pad

1999-07-12

2000-07-18

Rose, Robert A.

Abrading

Flexible-member tool, per se

Interrupted or composite work face

B24B 3704

Patent

active

060899654

ABSTRACT:
A polishing pad that can polish the surface of work pieces, such as semiconductor silicon wafers, with satisfactory results. Polishing pad 1.sub.1 is formed of a large number of resin polishing elements 11, all tubular with a very small diameter, inseparably bound together, outer peripheral surface to outer peripheral surface, with the axial direction tube end faces aligned on a plane, to form a plate structure 10 with two kinds of pores 12, 13, which are regularly positioned and run through the plate structure 10 in the thickness direction. Pad surface 1a of polishing pad 1.sub.1 is formed by the axial direction tube end faces of polishing elements 11 . . . . First pore 12 is the center pore in the polishing element 11. Second pore 13 is formed between the outer peripheral surfaces of the polishing elements 11 . . . .

REFERENCES:
patent: 2188365 (1940-01-01), Lent et al.
patent: 3623276 (1971-11-01), Twigg
patent: 5470273 (1995-11-01), Mertens
patent: 5609517 (1997-03-01), Lofaro
patent: 5795218 (1998-08-01), Doan et al.
patent: 5860851 (1999-01-01), Beppu et al.

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