Polishing pad

Details Polishing pad Polishing pad

2006-08-08

2006-08-08

Nguyen, Dung Van (Department: 3723)

Abrading

Abrading process

C451S532000

Reexamination Certificate

active

07086932

ABSTRACT:
An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.

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