Polishing pad

Details Polishing pad Polishing pad

2005-01-04

2005-01-04

Wilson, Lee D. (Department: 3723)

Abrading

Flexible-member tool, per se

Interrupted or composite work face

C451S041000, C451S059000, C451S526000, C451S528000, C451S529000, C451S534000, C451S539000, C156S345120, C156S345130

Reexamination Certificate

active

06837781

ABSTRACT:
A high quality polishing pad suitable for chemical mechanical polishing (CMP) of semiconductor wafer, etc. which is not affected by the change of polishing conditions during polishing and can attain excellent removal rate, capacity of step height reduction and uniformity is described, wherein a polyurethane-based foam12having fine and uniform cells20suitable for polishing of semiconductor material, etc. obtained by reaction-injection molding a gas-dissolved raw material prepared by dissolving an inert gas in a mixture of a polyurethane or polyurea as a main raw material and various subsidiary raw materials under pressure is used.

REFERENCES:
patent: 6171181 (2001-01-01), Roberts et al.
patent: 6328644 (2001-12-01), Kuramochi et al.
patent: 6361409 (2002-03-01), Vishwanathan et al.
patent: 6575824 (2003-06-01), Kuramochi et al.
patent: 6648733 (2003-11-01), Roberts et al.

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