Polishing pad

Details Polishing pad Polishing pad

2011-03-01

2011-03-01

Vo, Hai (Department: 1788)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Composite having voids in a component

C428S315500, C451S527000

Reexamination Certificate

active

07897250

ABSTRACT:
The present invention provides a polishing pad whose unevenness in thickness hardly occurs and whose life can be improved. A polishing pad1is provided with a polyurethane sheet2. Foams3having lengths of about ½ of the length of the polyurethane sheet2in its thickness direction and elongated foams4having lengths of at least 70% of the length of the polyurethane sheet2in the thickness direction are formed in the polyurethane sheet2. The foams3and the elongated foams4are opened by buffing processing so that opened pores5and opened pores6are formed at a polishing face P, respectively. Regarding the opened pores5, 6, the total number of opened pores having opened pore diameters falling in a range of from 30 to 50 μm occupies at least 50% of the number of all opened pores. The total number of the opened pores5, 6per 1 mm2of the polishing face P is set in a range of from 50 to 100. An average value of ratio of an opened pore diameter D1of the opened pore6of the elongated foam4to an opened pore diameter D2of the opened pore6at a depth position of at least 200 μm from the polishing face P is set in a range of from 0.65 to 0.95.

REFERENCES:
patent: 6899602 (2005-05-01), Fawcett et al.
patent: 7300335 (2007-11-01), Tajima et al.
patent: 2005/0112354 (2005-05-01), Kume et al.
patent: 2005-101541 (2005-04-01), None
patent: 2007-160474 (2007-06-01), None

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