Polishing monitoring method and polishing apparatus

Details Polishing monitoring method and polishing apparatus Polishing monitoring method and polishing apparatus

2008-10-09

2011-12-13

Decady, Albert (Department: 2121)

Data processing: measuring, calibrating, or testing

Measurement system in a specific environment

Electrical signal parameter measurement system

C451S005000, C451S008000, C324S230000, C702S097000, C702S170000, C700S164000

Reexamination Certificate

active

08078419

ABSTRACT:
A method monitors a change in film thickness during polishing using an eddy current sensor. This method includes acquiring an output signal of the eddy current sensor as a correction signal value during water-polishing of a substrate, during dressing of the polishing pad, or during replacement of the polishing pad, calculating a correcting amount from a difference between the correction signal value and a predetermined correction reference value, calculating an actual measurement signal value by subtracting the correction amount from the output signal of the eddy current sensor when polishing a substrate having a conductive film, and monitoring a change in thickness of the conductive film during polishing by monitoring a change in the actual measurement signal value.

REFERENCES:
patent: 6707540 (2004-03-01), Lehman et al.
patent: 7016795 (2006-03-01), Swedek et al.
patent: 7175505 (2007-02-01), Ko et al.
patent: 7198545 (2007-04-01), Korovin et al.
patent: 7264537 (2007-09-01), Laursen et al.
patent: 2004/0002171 (2004-01-01), Gotkis et al.
patent: 2005/0194971 (2005-09-01), Lehman et al.
patent: 2007/0103150 (2007-05-01), Tada et al.
patent: 2007/0243795 (2007-10-01), Kobayashi et al.
patent: 2005-121616 (2005-05-01), None

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