Polishing method and polishing apparatus using the same

Abrading – Precision device or process - or with condition responsive... – By optical sensor

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451 41, B24B 4912, B24B 4904

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active

060930810

ABSTRACT:
A polishing method of polishing the surface of a layer provided on the surface of a substrate includes a surface configuration measuring step of detecting surface information at a plurality of locations on the layer and obtaining the surface configuration of the layer, the surface configuration of the layer being obtained by measuring a distance from a reference surface set relative to the surface of the layer, a film thickness distribution measuring step of detecting the film thicknesses at a plurality of locations on the layer and obtaining the film thickness distribution of the layer, a determining step of determining whether the surface configuration and film thickness distribution of the layer are within a preset allowable range and a polishing controlling step of continuing or stopping the polishing on the basis of a result of the determination in the determining step.

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Patent Abstracts of Japan, vol. 014, No. 528, Nov. 1990 for No. 2-222533 filed Sep. 1990.

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