Polishing method and apparatus

Details Polishing method and apparatus Polishing method and apparatus

2006-07-25

2006-07-25

Nguyen, Dung Van (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S285000

Reexamination Certificate

active

07081038

ABSTRACT:
Provided is a polishing method of polishing a substrate by rotating the substrate and a pad while keeping the pad in contact with the substrate, the method including: a first polishing step of polishing the substrate by rotating the substrate and the pad in a first direction; and a second polishing step of polishing the substrate by rotating the substrate and the pad in a second direction opposite to the first direction.

REFERENCES:
patent: 6110021 (2000-08-01), Ota et al.
patent: 6270392 (2001-08-01), Hayashi et al.
patent: 6736696 (2004-05-01), Peng et al.
patent: 2002/0019198 (2002-02-01), Kamono
patent: 2002-25958 (2002-01-01), None
Nihon Veeco, New Criteria for the Symmetry of Alignment Mark's Profile by Atomic Force Profiler, Sep. 2002, The 63rdScience Lecture Meeting of the Society of Applied Physics (Preliminary Text) p. 640, and English translation thereof (3 pages).

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