Polishing material

Abrasive tool making process – material – or composition – With inorganic material – Metal or metal oxide

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Details

106 6, C09C 168

Patent

active

053001303

ABSTRACT:
A novel polishing slurry for particularly hard materials such a silicon carbide has been found. The slurry comprises diamond particles with a median particle size of around a micron and alpha alumina particles with a median size of from about 20 to about 200 nanometers.

REFERENCES:
patent: 4657754 (1987-04-01), Bauer et al.
patent: 5114437 (1992-05-01), Takeuchi et al.
patent: 5149338 (1992-09-01), Fulton

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