Abrading – Precision device or process - or with condition responsive... – Computer controlled
Reexamination Certificate
2005-04-05
2005-04-05
Wilson, Lee D. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
Computer controlled
C451S057000, C451S285000
Reexamination Certificate
active
06875076
ABSTRACT:
An apparatus and method is provided for polishing work pieces such as semiconductor wafers. The apparatus includes a variable number of independent heads20, platens32and polishing units18. This polishing apparatus belongs to a group of polishing machines with wafers attached to the same heads20through all polishing steps without undesirable reloading from one head20to another between polishing steps. Each independent head20is automatically coupled to and decoupled from any of the polishing units18to optimize throughput and provide flexibility in accommodating different polishing processes. A head transfer subsystem22provides an independent means of transfer for each head20, thus an infinite number of contemporaneous or overlapping polishing cycles can be completed on multiple wafers resulting in maximum processing throughput.
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Abrahamians Edmond
Keyfes Yakov
Kravtsov Igor
Owens, Jr. Herbert Wayne
Stone, III William Jefferson
Accretech USA, Inc.
Grant Alvin J
Harness Dickey & Pierce PLC
Wilson Lee D.
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