Polishing machine

Details Polishing machine Polishing machine

1998-07-16

2000-11-28

Eley, Timothy V.

Abrading

Abrading process

Utilizing fluent abradant

451 41, 451104, B24B 100

Patent

active

061528056

ABSTRACT:
The present invention provides a polishing machine in which the polishing face of the polishing pad is made to contact the polishing object face of the wafer with efficient supply of the polishing agent on the polishing object face of the processing object in the polishing process, the polishing object face of the wafer being polishing by allowing at least either one of them to rotate, wherein the wafer is polished by repeatedly making a contact and non-contact between the polishing pad and wafer during the polishing process in the polishing agent accommodated in the vessel.

REFERENCES:
patent: 4209947 (1980-07-01), Ohno
patent: 4789424 (1988-12-01), Fornadel et al.
patent: 4821466 (1989-04-01), Kato et al.
patent: 5040336 (1991-08-01), Ahern
patent: 5088238 (1992-02-01), Lin
patent: 5664990 (1997-09-01), Adams et al.
patent: 5725420 (1998-03-01), Torii
patent: 5817245 (1998-10-01), Iwamoto et al.

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