Polishing machine

Abrading – Machine – Rotary tool

Reexamination Certificate

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Details

C451S285000, C451S186000

Reexamination Certificate

active

06916234

ABSTRACT:
A polishing machine in which adverse influence caused by a surface condition of a retainer ring can be reduced with a simple structure. The polishing machine includes a rotatable polishing plate; a top ring including a holding plate for holding and pressing a wafer onto a polishing cloth of the polishing plate; an independently rotating retainer ring in which the holding plate is freely inserted; and a positioning member for correctly positioning the retainer ring on the polishing cloth while the retainer ring is rotated. The retainer ring includes a pressing member which presses the polishing cloth along an outer edge of the wafer to make the level of the polishing cloth pressed by the pressing member substantially equal to that of the polishing cloth pressed by the wafer.

REFERENCES:
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5857899 (1999-01-01), Volodarsky et al.
patent: 6019868 (2000-02-01), Kimura et al.
patent: 6113468 (2000-09-01), Natalicio
patent: 6132298 (2000-10-01), Zuniga et al.
patent: 6146259 (2000-11-01), Zuniga et al.
patent: 6435949 (2002-08-01), Katsuoka et al.
patent: 6443821 (2002-09-01), Kimura et al.
patent: 4-343658 (1992-11-01), None
patent: 2000-127024 (2000-05-01), None
patent: 2000-299301 (2000-10-01), None
patent: 2001-232553 (2001-08-01), None

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