Etching a substrate: processes – Nongaseous phase etching of substrate – Using film of etchant between a stationary surface and a...
Reexamination Certificate
2006-05-16
2009-10-20
Hendricks, Keith D (Department: 1794)
Etching a substrate: processes
Nongaseous phase etching of substrate
Using film of etchant between a stationary surface and a...
C216S089000, C252S079100
Reexamination Certificate
active
07604751
ABSTRACT:
A polishing liquid composition is applicable as a means of forming embedded metal interconnections on a semiconductor substrate. In a surface to be polished comprising an insulating layer and a metal interconnection layer, the polishing liquid composition is capable of maintaining a polishing speed of the metal layer, of suppressing an etching speed, and of preventing dishing of the metal layer.
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Hagihara Toshiya
Hashimoto Ryoichi
Yoneda Yasuhiro
George Patricia A
Hendricks Keith D
Kao Corporation
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
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