Polishing liquid

Details Polishing liquid Polishing liquid

2006-09-28

2010-11-30

Vinh, Lan (Department: 1713)

Compositions

Etching or brightening compositions

Inorganic acid containing

C252S079100, C252S079200, C252S079300, C438S625000, C438S645000, C438S692000

Reexamination Certificate

active

07842193

ABSTRACT:
According to an aspect of the invention, there is provided a polishing liquid for polishing a barrier metal material on an interlayer insulation material, the polishing liquid having a pH of from 2.0 to 6.0 and including an aqueous solution containing a compound represented by the following formula (1), and polishing particles containing silicon oxide and dispersed in the aqueous solution: R1—(CH2)m—(CHR2)n—COOH (1) wherein m+n≦4; R1represents a hydrogen atom, a methyl group, an ethyl group or a hydroxyl group; R2represents a methyl group, an ethyl group, a benzene ring or a hydroxyl group; and when a plurality of R2s are present in the formula (1), they are the same or different from one another.

REFERENCES:
patent: 6773476 (2004-08-01), Sakai et al.
patent: 7037352 (2006-05-01), Ito et al.
patent: 7300480 (2007-11-01), Bian et al.
patent: 7442645 (2008-10-01), Carter et al.
patent: 2005/0173669 (2005-08-01), Kurata et al.
patent: 2000-84832 (2000-03-01), None
patent: 2003-17446 (2003-01-01), None
patent: 2003-142435 (2003-05-01), None

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