Polishing head using zone control

Details Polishing head using zone control Polishing head using zone control

2011-03-15

2011-03-15

Morgan, Eileen P. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Controlling temperature

C451S041000, C451S053000, C451S287000

Reexamination Certificate

active

07905764

ABSTRACT:
A polishing head for a chemical mechanical polishing apparatus is provided which includes at least two polishing head zones configured to provide different temperatures for transferring heat to at least two zones of a substrate corresponding to the at least two polishing head zones. The present disclosure addresses chemical mechanical polishing which allows a control of the polishing profile even if slurries are used, which show almost no dependency between polishing rate and down force.

REFERENCES:
patent: 6150271 (2000-11-01), Easter et al.
patent: 6749484 (2004-06-01), Yang et al.
patent: 7238084 (2007-07-01), Kim
patent: 2003/0114077 (2003-06-01), Yang et al.
patent: 2003/0186623 (2003-10-01), Pham et al.
patent: 1 852 220 (2007-11-01), None
Translation of Official Communication from German Patent Office for German Patent Application No. 10 2007 041 209.8 dated May 7, 2008.

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