Polishing head of chemical mechanical polishing apparatus

Details Polishing head of chemical mechanical polishing apparatus Polishing head of chemical mechanical polishing apparatus

2006-04-18

2006-04-18

Eley, Timothy V. (Department: 3724)

Abrading

Machine

Rotary tool

C451S388000, C451S398000

Reexamination Certificate

active

07029383

ABSTRACT:
A polishing head of a wafer polishing apparatus includes a body, a center supporter installed in a center of the body, a perforated plate including an upper plate and a lower plate that is disposed below the center supporter and has a plurality of thru-holes, a membrane covering the perforated plate, and a moving member for moving the lower plate up and down. By moving the lower plate up and down, the polishing head forcibly recovers an elasticity of the membrane (especially at an edge portion of the membrane).

REFERENCES:
patent: 6241593 (2001-06-01), Chen et al.
patent: 6336846 (2002-01-01), Park et al.
patent: 6755726 (2004-06-01), Chen et al.
patent: 2001/0013503 (2001-08-01), Custer et al.
patent: 2003/0181153 (2003-09-01), Chen et al.
patent: 2001-219368 (2001-08-01), None

Affiliated with

Also associated with

Rating

Polishing head of chemical mechanical polishing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing head of chemical mechanical polishing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing head of chemical mechanical polishing apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3565611