Polishing head for polishing semiconductor wafers

Details Polishing head for polishing semiconductor wafers Polishing head for polishing semiconductor wafers

2008-04-29

2008-04-29

Rose, Robert (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S388000, C451S289000

Reexamination Certificate

active

11680588

ABSTRACT:
A polishing head and method for handling and polishing semiconductor wafers uses a base structure with at least one recess region and an outer flexible membrane that can conform to the at least one recess region to form at least one depression to hold a semiconductor wafer onto the outer flexible membrane when suction is applied to the at least one depression.

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