Polishing head for polishing semiconductor wafers

Abrading – Abrading process – Glass or stone abrading

Reexamination Certificate

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C451S388000, C451S289000

Reexamination Certificate

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07364496

ABSTRACT:
A polishing head and method for handling and polishing semiconductor wafers uses a base structure with at least one recess region and an outer flexible membrane that can conform to the at least one recess region to form at least one depression to hold a semiconductor wafer onto the outer flexible membrane when suction is applied to the at least one depression.

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