Polishing head and chemical mechanical polishing apparatus

Details Polishing head and chemical mechanical polishing apparatus Polishing head and chemical mechanical polishing apparatus

2006-09-05

2006-09-05

Rachuba, M. (Department: 3723)

Abrading

Machine

Rotary tool

C451S288000, C451S397000, C451S402000

Reexamination Certificate

active

07101271

ABSTRACT:
An apparatus for polishing chemically and mechanically a wafer includes a membrane supporter and a membrane. The membrane has a pressure portion that is divided into a plurality of regions, and a partition portion extending from the border between the plurality regions. The partition portion of the membrane is fixed to a slider that can move up and down in a guide groove formed in the membrane supporter.

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patent: 2002/0077051 (2002-06-01), Keller
patent: 2002/0182996 (2002-12-01), Zuniga et al.

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