Abrading – Precision device or process - or with condition responsive... – Computer controlled
Patent
1995-12-28
1998-10-27
Rose, Robert A.
Abrading
Precision device or process - or with condition responsive...
Computer controlled
451 67, 451288, B24B 722, B24B 5100
Patent
active
058271104
ABSTRACT:
A polishing facility integrates separate components of polishing such as wafer transport, polishing, cleaning and drying in one standardized facility to provide efficient polishing operation at low cost. The facility is designed to deal with a variety of different types of wafers, including different types of surface film, and is designed also to enables quick and low cost upgrading of the facility to meet advancing requirements of customers. The polishing facility can be placed within a cleanroom to provide efficient handling of polished wafers for further processing and fabrication tasks. Individual work component of polishing is arranged in one block having its own power supply and signal lines, and is controlled by a central controller having a dedicated software program for each work component. Therefore, if upgrading of the facility is required on any work component, only that work component requiring attention needs to be repaired/replaced, thus eliminating the need to shut down the entire facility as in conventional polishing setups. Each work component is modularized for easy replacement and inventory purposes. The overall effect of the integrated polishing facility is that the efficiency of the polishing operation is significantly improved at minimal cost of labor and capital investments.
Aoki Riichiro
Imoto Yukio
Kodama Shoichi
Nishi Toyomi
Omichi Takashi
Ebara Corporation
Kabushiki Kaisha Toshiba
Rose Robert A.
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