Polishing endpoint detection method

Details Polishing endpoint detection method Polishing endpoint detection method

1996-01-18

1997-06-17

Breneman, R. Bruce

Etching a substrate: processes

Nongaseous phase etching of substrate

With measuring, testing, or inspecting

216 88, 1566261, 1566451, 1566361, 451 41, 437 8, 437225, H01L 2166, B24B 4916

Patent

active

056393881

ABSTRACT:
An endpoint detection in a polishing process of a polishing object which has a first layer and a second layer, formed under the first layer, is performed by holding the polishing object on a top ring and pressing a surface of the first layer of the polishing object onto a polishing cloth mounted on a rotating turntable so as to remove the first layer, oscillating the top ring in contact with the turntable, periodically measuring a torque on the rotating turntable when the top ring is positioned at a specific radial location defined by a radius from a rotational center of the turntable, and determining the endpoint based on a change in the torque generated when the first layer is removed and the second layer comes into contact with the polishing cloth.

REFERENCES:
patent: 4910155 (1990-03-01), Cote et al.
patent: 5036015 (1991-07-01), Sandhu et al.
patent: 5069002 (1991-12-01), Sandhu et al.
patent: 5232875 (1993-08-01), Tuttle et al.
patent: 5308438 (1994-05-01), Cote et al.
IBM Technical Disclosure Bulletin, vol. 31, No. 4, J.D. Warnock, Sep. 1988 "End Point Detector For Chemi-Mechanical Polisher".

Affiliated with

Also associated with

Rating

Polishing endpoint detection method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing endpoint detection method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing endpoint detection method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2155422