Polishing device having a pad which has grooves and holes

Details Polishing device having a pad which has grooves and holes Polishing device having a pad which has grooves and holes

1996-10-22

1998-03-10

Rose, Robert A.

Abrading

Machine

Rotary tool

451286, 451287, 451288, 451289, 451527, 451 41, B24B 500

Patent

active

057254206

ABSTRACT:
Shallow grooves are formed on the surface of a hard layer of a polishing pad for polishing the wafer so as to join a plurality of. Since the grooves are formed for causing no negative pressure between the polishing pad and the wafer, the distance between the grooves is made more than several times as large as the pitch between the holes.

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