Polishing device and polishing method

Details Polishing device and polishing method Polishing device and polishing method

2011-02-01

2011-02-01

MacArthur, Sylvia R. (Department: 1716)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

For liquid etchant

C216S088000

Reexamination Certificate

active

07879180

ABSTRACT:
Disclosed are a polishing device and polishing method for forming a wafer with high flatness using a CMP process. For the polishing of the wafer, a polishing device including a chuck section and a polishing member having a needle member is used. In the polishing, the wafer is fixed on the chuck section and then, a working fluid containing no abrasive grains is supplied to a wafer surface as well as the needle member is pressed against the wafer surface and is caused to rapidly vibrate. By doing so, the needle member tip is caused to vibrate to rub the wafer surface, thereby performing the polishing. As a result, dishings due to asperities on the wafer surface or scratches extending over a wide range are prevented from occurring, so that the wafer with high flatness can be obtained.

REFERENCES:
patent: 4999954 (1991-03-01), Miyamoto et al.
patent: 5351360 (1994-10-01), Suzuki et al.
patent: 5639311 (1997-06-01), Holley et al.
patent: 6055694 (2000-05-01), Steere
patent: 6818095 (2004-11-01), Kim
patent: 6997791 (2006-02-01), Lee
patent: 7004823 (2006-02-01), Kisboll et al.
patent: 2007/0199923 (2007-08-01), Takahashi
patent: 2000-49122 (2000-02-01), None
patent: 2003-109919 (2003-04-01), None
Machine Generated English Translation of JP2003109919A, published Apr. 11, 2003.

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