Polishing device and correcting method therefor

Details Polishing device and correcting method therefor Polishing device and correcting method therefor

1996-04-05

1997-10-28

Rose, Robert A.

Abrading

Machine

Rotary tool

451289, 451364, B24B 722

Patent

active

056812124

ABSTRACT:
Disclosed herein is a polishing including a polishing plate having an upper surface on which a polishing pad is attached, a polishing head having a lower surface opposed to an upper surface of the polishing pad on the polishing plate, for holding a substrate to be polished on the lower surface, and a pressure source for applying a polishing pressure to the polishing head, whereby the substrate held by the polishing head is pressed against the upper surface of the polishing pad under the polishing pressure applied from the pressure source to perform polishing of the substrate. The polishing head is provided with a contact pressure adjusting mechanism capable of adjusting an in-plane contact pressure of the substrate against the upper surface of the polishing pad on the polishing plate at every area of the substrate. Accordingly, the uniformity and the planarity in the plane of the substrate surface to be polished can be improved with a high throughput.

REFERENCES:
patent: 3505766 (1970-04-01), Boettcher et al.
"Controlling the Lapping of Surfaces". IBM Technical Disclosure Bulletin, Erickson, vol.22, No. 2, pp. 469-470 Jul. 1979.

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