Polishing control method

Details Polishing control method Polishing control method

1995-11-30

1997-11-11

Eley, Timothy V.

Abrading

Abrading process

Utilizing fluent abradant

451 41, 451 59, 451 5, 451 9, B24C 108

Patent

active

056857667

ABSTRACT:
Polishing of wafers, such as wafers of semiconductive material is carried out by mounting the wafer to a carrier, and pressing the wafer against a polishing pad carrying a polishing media. An antenna is placed beneath the polishing pad and electrical energization is applied between the carrier assembly and the antenna. The electrical energization preferably includes a direct current bias, but may also include ratio frequency carrier injection signal. The noise associated with ionic disassociation is monitored to assess ongoing polishing activity, on a real time basis.

REFERENCES:
patent: 4141180 (1979-02-01), Gill, Jr. et al.
patent: 4211041 (1980-07-01), Sakulevich et al.
patent: 4272924 (1981-06-01), Masuko et al.
patent: 4680893 (1987-07-01), Cronkhite et al.
patent: 5069002 (1991-12-01), Sandhu et al.
patent: 5224304 (1993-07-01), Cesna
patent: 5240552 (1993-08-01), Yu et al.
patent: 5245794 (1993-09-01), Salugsugan
patent: 5265378 (1993-11-01), Rostoker
patent: 5329732 (1994-07-01), Karlsrud et al.
patent: 5562529 (1996-10-01), Kishii et al.

Affiliated with

Also associated with

Rating

Polishing control method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing control method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing control method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1224596