Polishing compound, method for production thereof, and...

Abrasive tool making process – material – or composition – With inorganic material – Clay – silica – or silicate

Reexamination Certificate

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C051S307000, C051S309000, C106S003000, C438S692000, C438S693000

Reexamination Certificate

active

07854777

ABSTRACT:
A heterocyclic benzene compound such as benzotriazole, is dissolved in at least one substance selected from the group consisting of a primary alcohol having from 1 to 4 carbon atoms, a glycol having from 2 to 4 carbon atoms, an ether represented by the Formula 2 (wherein m is an integer of from 1 to 4), N-methyl-2-pyrrolidone, N,N-dimethylformamide, dimethyl sulfoxide, γ-butyrolactone and propylene carbonate, and an aqueous dispersion of fine oxide particles which constitute abrasive grains is mixed therewith, whereby a polishing compound is obtained. By use of this polishing compound in polishing a substrate provided with an insulating film2on which a wiring metal film4and a barrier film3are formed, the formation of an embedded wiring5is made possible with low dishing, low erosion and low scratching at a high removal rate.

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