Polishing composition for glass substrate

Details Polishing composition for glass substrate Polishing composition for glass substrate

2011-07-05

2011-07-05

Lorengo, Jerry (Department: 1731)

Abrasive tool making process, material, or composition

With inorganic material

Clay, silica, or silicate

C051S307000, C451S041000

Reexamination Certificate

active

07972398

ABSTRACT:
The present invention provides a polishing composition for a glass substrate having a pH of from 1 to 5 and containing silica particles having an average particle size of from 5 to 100 nm, wherein, in a projected image of the silica particles obtainable by an image analysis of electron photomicrographs, an average of an area ratio R of a projected area of the silica particles (A1) to an area of a maximum inscribed circle of the silica particles (A), i.e. (A1/A), is in the range of from 1.2 to 3.0, and the silica particles have an average of 2.0 to 10 projection portions having a curvature radius of from ⅕ to ½ of a radius of the maximum inscribed circle of the silica particles (r) on the outline of the silica particles in the projected image, and a method for manufacturing a glass substrate, including the step of polishing a substrate to be polished with a polishing load of from 3 to 12 kPa and at a pH of from 1 to 5 while allowing the polishing composition to be present between a polishing pad and the substrate to be polished. The polishing composition for a glass substrate of the present invention can be suitably used, for example, in the manufacture of glass hard disks, aluminosilicate glass for reinforced glass substrates, glass ceramic substrates (crystallized glass substrates), and the like.

REFERENCES:
patent: 6398827 (2002-06-01), Ota et al.
patent: 2004/0065021 (2004-04-01), Yoneda et al.
patent: 2421955 (2006-07-01), None
patent: 2433516 (2007-06-01), None
patent: 2001-11433 (2001-01-01), None
patent: 2001064631 (2001-03-01), None
patent: 3441142 (2003-06-01), None
patent: WO-2005/123857 (2005-12-01), None
English language abstract of JP 2002-338232 A (Nov. 27, 2002).
English language abstract of JP 2004-311652 A (Nov. 4, 2004).
Office Action mailed Jan. 31, 2011 issued in corresponding Chinese patent application No. 200710127194.1 (with English translation).

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