Polishing composition and rinse composition

Abrasive tool making process – material – or composition – With inorganic material – Clay – silica – or silicate

Reexamination Certificate

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C106S003000, C106S005000

Reexamination Certificate

active

10674209

ABSTRACT:
A polishing composition for reducing the haze level of the surface of silicon wafers contains hydroxyethyl cellulose, polyethylene oxide, an alkaline compound, water, and silicon dioxide.

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patent: 2002/0151252 (2002-10-01), Kawase et al.
patent: 63272459 (1988-09-01), None
patent: 11-116942 (1999-04-01), None

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