Abrasive tool making process – material – or composition – With inorganic material – Clay – silica – or silicate
Reexamination Certificate
2007-05-01
2007-05-01
Marcheschi, Michael (Department: 1755)
Abrasive tool making process, material, or composition
With inorganic material
Clay, silica, or silicate
C106S003000, C106S005000
Reexamination Certificate
active
10674209
ABSTRACT:
A polishing composition for reducing the haze level of the surface of silicon wafers contains hydroxyethyl cellulose, polyethylene oxide, an alkaline compound, water, and silicon dioxide.
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Fujimi Incorporated
Marcheschi Michael
Vidas Arrett & Steinkraus P.A.
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