Polishing composition and polishing method

Details Polishing composition and polishing method Polishing composition and polishing method

2006-08-30

2010-02-02

Lorengo, Jerry (Department: 1793)

Abrasive tool making process, material, or composition

With synthetic resin

C051S307000, C051S308000, C051S309000

Reexamination Certificate

active

07655057

ABSTRACT:
A polishing composition contains a compound represented by the general formula (1) below and abrasive grains. In the general formula (1), X represents a residue of polyether polyol (having a polyether chain containing an oxyethylene group in an amount of 20 to 90% by mass) derived from a compound having an active hydrogen atom and an alkylene oxide; m represents an integer of 2 to 8, which is equal to the number of hydroxy groups contained in a single polyether polyol molecule; Y and Z represent a lower alcohol residue to which ethylene oxide or propylene oxide is added by addition polymerization, an alkyl group or an alkylene group, respectively; and n is an integer of 3 or more.

REFERENCES:
patent: 4225349 (1980-09-01), Koshiyama et al.
patent: 4935039 (1990-06-01), Miyazaki et al.
patent: 4956015 (1990-09-01), Okajima et al.
patent: 2004/0187393 (2004-09-01), Mutoh et al.
patent: 7-11239 (1995-01-01), None
patent: 2004-300347 (2004-10-01), None

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