Polishing composition and polishing method

Details Polishing composition and polishing method Polishing composition and polishing method

2011-08-16

2011-08-16

Green, Anthony J (Department: 1731)

Abrasive tool making process, material, or composition

With inorganic material

Clay, silica, or silicate

C051S302000, C051S303000, C106S003000

Reexamination Certificate

active

07998229

ABSTRACT:
The polishing composition contains polyoxyethylene sorbitan mono-fatty acid ester, silicon dioxide, water soluble cellulose, an alkaline compound, and water. The content of polyoxyethylene sorbitan mono-fatty acid ester in the polishing composition is less than 0.0025% by mass. The polishing composition is appropriate for final polishing of silicon wafers.

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