Polishing composition

Details Polishing composition Polishing composition

2007-11-30

2010-02-23

Lorengo, Jerry (Department: 1793)

Abrasive tool making process, material, or composition

With inorganic material

C051S308000, C051S309000, C106S003000, C252S079100, C216S089000, C216S096000, C216S100000

Reexamination Certificate

active

07666238

ABSTRACT:
A polishing composition comprising an abrasive and water, wherein the polishing composition has an index of degree of sedimentation of 80 or more and 100 or less; a process for producing a substrate comprising polishing a substrate to be polished using the above-mentioned composition; a process for preventing clogging of a polishing pad comprising applying the above-mentioned composition; a process for preventing clogging of a polishing pad comprising applying the above-mentioned composition to polishing with a polishing pad for a nickel-containing object to be polished; and a process for preventing clogging of a polishing pad comprising applying a composition comprising a hydrophilic polymer having two or more hydrophilic groups in its molecule and a molecular weight of 300 or more, or a compound capable of dissolving nickel hydroxide at a pH of 8.0, and water to polishing with a polishing pad for a nickel-containing object to be polished.

REFERENCES:
patent: 4956015 (1990-09-01), Okajima et al.
patent: 5226955 (1993-07-01), Owaki
patent: 6224464 (2001-05-01), Nojo et al.
patent: 6375545 (2002-04-01), Yano et al.
patent: 6440856 (2002-08-01), Bessho et al.
patent: 6569216 (2003-05-01), Taira et al.
patent: 6783434 (2004-08-01), Akahori et al.
patent: 2001/0003672 (2001-06-01), Inoue et al.
patent: 2001/0006225 (2001-07-01), Tsuchiya et al.
patent: 2001/0051746 (2001-12-01), Hagihara et al.
patent: 2002/0037642 (2002-03-01), Wake et al.
patent: 2002/0129559 (2002-09-01), Ito et al.
patent: 2003/0006396 (2003-01-01), Wang et al.
patent: 1253963 (2000-05-01), None
patent: 1020501 (2000-07-01), None
patent: 07-070553 (1995-03-01), None
patent: 7-216345 (1995-08-01), None
patent: 9-137156 (1997-05-01), None
patent: 9-143455 (1997-06-01), None
patent: 11-293231 (1999-10-01), None
patent: 11-349926 (1999-12-01), None
patent: 2000-63805 (2000-02-01), None
patent: 2000-160141 (2000-06-01), None
patent: 2001-064631 (2001-03-01), None
patent: 2001-064632 (2001-03-01), None
patent: 2001-064681 (2001-03-01), None
patent: 2001-064685 (2001-03-01), None
patent: 2001-064688 (2001-03-01), None
patent: 2001-085372 (2001-03-01), None
patent: 2001-89746 (2001-04-01), None
patent: 2001-107089 (2001-04-01), None
patent: 2001-155332 (2001-06-01), None
patent: 2001-187879 (2001-07-01), None
patent: WO-00/32712 (2000-06-01), None
Office Action issued in Japanese Application No. 2001-226322 (dated Jul. 3, 2009) (Without Translation).

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