Polishing composition

Abrasive tool making process – material – or composition – With inorganic material

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C051S309000, C106S003000, C216S096000, C216S101000, C216S108000, C510S165000, C510S167000

Reexamination Certificate

active

07553345

ABSTRACT:
A microwaviness reducing agent for polishing a substrate for a precision part, containing either a surfactant having two or more ionic hydrophilic groups, or a polycarboxylic acid compound having 2 to 15 total carbon atoms and having either OH group or groups or SH group or groups, or a salt thereof; a polishing composition for a substrate for a precision part, containing the microwaviness reducing agent, an abrasive and water; a polishing composition comprising water, an abrasive, an organic acid or a salt thereof, and a surfactant, wherein the organic acid is a polycarboxylic acid compound having 2 to 15 total carbon atoms and having either OH group or groups or SH group or groups, and wherein the surfactant has two or more ionic hydrophilic groups in its molecule and has a molecular weight of 300 or more; a method of reducing microwaviness of a substrate for a precision part; and a method for manufacturing a substrate for a precision part.

REFERENCES:
patent: 4752628 (1988-06-01), Payne
patent: 5700383 (1997-12-01), Feller et al.
patent: 5997620 (1999-12-01), Kodama et al.
patent: 6224464 (2001-05-01), Nojo et al.
patent: 6258140 (2001-07-01), Shemo et al.
patent: 6316366 (2001-11-01), Kaufman et al.
patent: 6783434 (2004-08-01), Akahori et al.
patent: 6786945 (2004-09-01), Machii et al.
patent: 2001/0017007 (2001-08-01), Hagihara et al.
patent: 2001/0051746 (2001-12-01), Hagihara et al.
patent: 2002/0081949 (2002-06-01), Yoshida et al.
patent: 2002/0102923 (2002-08-01), Sugiyama et al.
patent: 2003/0006396 (2003-01-01), Wang et al.
patent: 2003/0041526 (2003-03-01), Fujii et al.
patent: 2003/0211743 (2003-11-01), Chang et al.
patent: 2003/0228762 (2003-12-01), Moeggenborg et al.
patent: 2003/0228763 (2003-12-01), Schroeder et al.
patent: 2004/0025742 (2004-02-01), Kitayama et al.
patent: 2004/0092103 (2004-05-01), Fujii et al.
patent: 2004/0132385 (2004-07-01), Kitayama et al.
patent: 1050568 (2000-11-01), None
patent: 1333476 (2003-08-01), None
patent: 2 393 186 (2004-03-01), None
patent: 63-318257 (1988-12-01), None
patent: 1-121163 (1989-05-01), None
patent: 02-158684 (1990-06-01), None
patent: 10-204416 (1998-08-01), None
patent: 2000-192015 (2000-07-01), None
patent: 2000-273445 (2000-10-01), None
patent: 2000-323444 (2000-11-01), None
patent: 2001-064632 (2001-03-01), None
patent: 2001-085372 (2001-03-01), None
patent: 2001-214155 (2001-08-01), None
patent: 2002-020732 (2002-01-01), None
patent: 2002-030273 (2002-01-01), None
patent: 2002-030274 (2002-01-01), None
patent: 2002-167575 (2002-06-01), None
patent: 2002-327170 (2002-11-01), None
patent: WO-01/23485 (2001-04-01), None
patent: 02/67309 (2002-02-01), None
patent: WO-03/072671 (2003-09-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Polishing composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing composition will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4073297

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.