Polishing composition

Details Polishing composition Polishing composition

2004-09-29

2009-02-03

Lorengo, J. A. (Department: 1793)

Abrasive tool making process, material, or composition

With inorganic material

Clay, silica, or silicate

C438S691000, C438S692000, C438S693000, C438S645000, C252S079100

Reexamination Certificate

active

07485162

ABSTRACT:
A polishing composition of the present invention, to be used in polishing for forming wiring in a semiconductor device, includes: a specific surfactant; a silicon oxide; at least one selected from the group consisting of carboxylic acid and alpha-amino acid; a corrosion inhibitor; an oxidant; and water. This polishing composition is capable of suppressing the occurrence of the dishing.

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