Polishing composition

Details Polishing composition Polishing composition

2007-12-04

2007-12-04

Marcheschi, Michael (Department: 1755)

Abrasive tool making process, material, or composition

With inorganic material

Clay, silica, or silicate

C106S003000, C510S165000, C510S167000, C451S041000, C451S036000

Reexamination Certificate

active

10727571

ABSTRACT:
A polishing composition for memory hard disk containing water and silica particles, wherein the silica particles have a particle size distribution in which the relationship of a particle size (R) and a cumulative volume frequency (V) in a graph of particle size-cumulative volume frequency obtained by plotting a cumulative volume frequency (%) of the silica particles counted from a small particle size side against a particle size (nm) of the silica particles in the range of particle sizes of from 40 to 100 nm satisfy the following formula (1): V≧0.5×R+40 (1), wherein the particle size is determined by observation with a transmission electron microscope (TEM). The polishing composition of the present invention can be even more suitably used for the manufacture of a substrate for precision parts such as substrates for memory hard disks.

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