Compositions – Electrically conductive or emissive compositions – Metal compound containing
Patent
1997-12-05
2000-02-22
Kopec, Mark
Compositions
Electrically conductive or emissive compositions
Metal compound containing
106636, 1062867, 106 3, 427331, H01B 104, C09D 100
Patent
active
06027669&
ABSTRACT:
A polishing composition comprising fumed silica, a basic potassium compound and water, of which the specific electric conductivity is from 100 to 5,500 .mu.S/cm.
REFERENCES:
patent: 5244534 (1993-09-01), Yu et al.
patent: 5352277 (1994-10-01), Sasaki
patent: 5376222 (1994-12-01), Miyajima et al.
patent: 5575837 (1996-11-01), Kodama et al.
Database WPI, Derwent Publications, AN 94-005184, SU 1 781 270, Dec. 15, 1992.
Database WPI, Derwent Publications, AN 82-54236E, SU 859 406, Aug. 30, 1981.
Database WPI, Derwent Publications, AN 83-51359K, SU 943 264, Jul. 15, 1982.
Database WPI, Derwent Publications, AN 75-59846W, SU 457 712, Mar. 11, 1975.
Patent Abstracts of Japan, vol. 96, No. 8, Aug. 30, 1996, JP 8-107094, Apr. 23, 1996.
Patent Abstracts of Japan, vol. 18, No. 477 (E-1602), Sep. 6, 1994, JP 6-163490, Jun. 10, 1994.
Patent Abstracts of Japan, vol. 97, No. 2, Feb. 28, 1997, JP 8-267356, Oct. 15, 1996.
Kawamura Atsunori
Miura Shirou
Tamai Kazusei
Fujimi Incorporated
Kopec Mark
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