Abrasive tool making process – material – or composition – With inorganic material – Clay – silica – or silicate
Reexamination Certificate
2006-12-12
2006-12-12
Marcheschi, Michael (Department: 1755)
Abrasive tool making process, material, or composition
With inorganic material
Clay, silica, or silicate
C106S003000, C438S692000, C438S693000
Reexamination Certificate
active
07147682
ABSTRACT:
A polishing composition for a substrate for memory hard disk comprising water and silica particles, wherein the silica particles have a particle size distribution in which the relationship of a particle size (R) and a cumulative volume frequency (V) in a graph of particle size-cumulative volume frequency obtained by plotting a cumulative volume frequency (%) of the silica particles counted from a small particle size side against a particle size (nm) of the silica particles satisfies the above formula (1) and the above formula (2), and wherein a particle size at 90% of a cumulative volume frequency (D90) is within the range of 65 nm or more and less than 105 nm. By using the polishing composition of the present invention, there can be efficiently manufactured an Ni—P plated substrate for a disk polished to have an excellent surface smoothness, in which the micropits are effectively reduced.
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Hagihara Toshiya
Nishimoto Kazuhiko
Oshima Yoshiaki
Birch & Stewart Kolasch & Birch, LLP
Kao Corporation
Marcheschi Michael
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