Polishing composition

Details Polishing composition Polishing composition

2006-07-04

2006-07-04

Wilson, Lee D. (Department: 3723)

Abrading

Abrading process

Abradant supplying

C451S036000, C451S041000

Reexamination Certificate

active

07070485

ABSTRACT:
A polishing composition to remove metal from a dielectric layer by, either single step CMP polishing, or two step CMP polishing, the composition including, an aqueous solution provided with a substance having molecules with respective silanols, and a concentration of ions that solublize the silanols to adsorb on a hydrated surface of the dielectric layer during said polishing.

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patent: 0 373 501 (1990-06-01), None
patent: WO 01/4226 (2001-01-01), None

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