Polishing composition

Details Polishing composition Polishing composition

2005-02-01

2005-02-01

Marcheschi, Michael (Department: 1755)

Abrasive tool making process, material, or composition

With inorganic material

Clay, silica, or silicate

C106S003000, C438S692000, C438S693000

Reexamination Certificate

active

06849099

ABSTRACT:
There is provided a polishing composition that reduces erosion and is used in a final polishing step of a semiconductor device manufacturing process. The polishing composition contains colloidal silica, a periodic acid compound, ammonia, ammonium nitrate and water and its pH is 1.8 to 4.0.

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