Polishing cloth for use in a CMP process and a surface treatment

Details Polishing cloth for use in a CMP process and a surface treatment Polishing cloth for use in a CMP process and a surface treatment

1997-06-27

2000-09-05

Utech, Benjamin L.

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

438693, H01L 21302

Patent

active

061142476

ABSTRACT:
A method of fabricating a semiconductor device includes a step of polishing a surface of a substrate by a chemical mechanical polishing process conducted on a polishing cloth by a slurry. The polishing is conducted so that projections having a height of about 30 .mu.m or less are formed on the polishing cloth with an interval of about 55 .mu.m or less as a result of the polishing.

REFERENCES:
patent: 5167667 (1992-12-01), Prigge et al.
patent: 5728308 (1998-03-01), Muroyama
patent: 5763325 (1998-06-01), Kishii et al.
patent: 5779521 (1998-07-01), Muroyama et al.

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