Abrading – Abrading process – Glass or stone abrading
Utility Patent
1999-09-21
2001-01-02
Scherbel, David A. (Department: 3723)
Abrading
Abrading process
Glass or stone abrading
C451S286000
Utility Patent
active
06168504
ABSTRACT:
TECHNICAL FIELD
This invention relates to polishing chucks, to semiconductor wafer polishing chucks, to abrading methods, to polishing methods, to semiconductor wafer polishing methods, and to methods of forming polishing chucks.
BACKGROUND OF THE INVENTION
Polishing systems can typically include a polishing chuck which holds a work piece, and a platen upon which a polishing pad is mounted. One or more of the chuck and platen can be rotated and brought into physical contact with the other, whereby the work piece or portions thereof are abraded, ground, or otherwise polished. One problem associated with abrading, grinding or polishing work pieces in such systems, concerns uniformly removing or controlling the amount of material being removed from over the surface of a work piece.
Specifically, because of the dynamics involved in abrading work pieces, greater amounts of material can be removed over certain portions of a work piece, while lesser amounts of material are removed over other portions. Such can result in an undesirable abraded, ground, or polished profile. Yet, in other applications, it can be desirable to remove, somewhat unevenly, material from over certain portions of a work piece and not, or to a lesser degree over other portions of a work piece.
This invention arose out of concerns associated with providing improved uniformity in abrading, grinding, and/or polishing scenarios. In particular, this invention arose out of concerns associated with providing uniformity and flexibility in the context of semiconductor wafer processing, wherein such processing includes abrading, grinding, or otherwise polishing a semiconductor wafer or work piece.
SUMMARY OF THE INVENTION
Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks are described. In one embodiment, a polishing chuck includes a body dimensioned to hold a work piece, and a multi-positionable, force-bearing engagement surface is positioned on the body to engage at least a portion of a work piece held thereby. The surface has an undeflected position, and is bi-directionally deflectable away from the undeflected position. In another embodiment, a yieldable engagement surface is provided on the body and has a central area and a peripheral area outward of the central area. One of the central and peripheral areas is movable, relative to the other of the areas to provide both inwardly and outwardly flexed surface configurations. In yet another embodiment, a generally planar surface is provided on the body and positioned to receive the work piece thereagainst. The surface is movable into a non-planar, force-varying configuration in which more force is exerted on outermost portions of a work piece during polishing than on innermost portions of a work piece. A deflector is operably connected with the surface and configured to move the surface into the non-planar configuration. In a preferred embodiment, a force-varying deflector on the body is configured and operable to move the body surface into both concave and convex force-varying configurations.
REFERENCES:
patent: 3977130 (1976-08-01), Degner
patent: 4918869 (1990-04-01), Kitta
patent: 5036630 (1991-08-01), Kaanta et al.
patent: 5095661 (1992-03-01), Gill, Jr. et al.
patent: 5400547 (1995-03-01), Tanaka et al.
patent: 5441444 (1995-08-01), Nakajima
patent: 5486129 (1996-01-01), Sandhu et al.
patent: 5532903 (1996-07-01), Kendall
patent: 5584746 (1996-12-01), Tanaka et al.
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5588902 (1996-12-01), Tominaga et al.
patent: 5624299 (1997-04-01), Shendon
patent: 5645474 (1997-07-01), Kubo et al.
patent: 5724121 (1998-03-01), McKinley et al.
patent: 5769697 (1998-06-01), Nishio
patent: 5816900 (1998-10-01), Nagahara et al.
patent: 5931725 (1999-08-01), Inaba et al.
patent: 5938884 (1999-08-01), Hoshizaki et al.
Micro)n Technology, Inc.
Ojini Anthony
Scherbel David A.
Wells, St. John, Roberts Gregory & Matkin P.S.
LandOfFree
Polishing chucks, semiconductor wafer polishing chucks,... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Polishing chucks, semiconductor wafer polishing chucks,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing chucks, semiconductor wafer polishing chucks,... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2547747