Polishing body

Details Polishing body Polishing body

2007-05-15

2007-05-15

Marcheschi, Michael A. (Department: 1755)

Abrasive tool making process, material, or composition

With synthetic resin

C051S307000, C051S308000, C051S309000, C051S293000, C451S526000, C451S041000

Reexamination Certificate

active

11288094

ABSTRACT:
An object of the present invention is to provide a polishing body, wherein the abrasive in the polishing body are extremely dispersed well, which provides stable polishing performance in the polishing process, and which can effectively reduce the occurrence of scratches even in a case a large quantity of the abrasive are contained. A polishing part constituting the polishing body in the invention is produced obtained by loading predetermined amounts of butadiene, styrene, methyl methacrylate, itaconic acid, acrylic acid, α-methylstyrenedimer, and t-dodecylmercaptan in an autoclave, making the mixture react for 16 hours at 75° C. to obtain an emulsion wherein a copolymer is dispersed, adjusting this emulsion to pH8.5, incorporating cerium oxide powder with an average primary particle diameter of 0.3 μm and stirring to obtain an aqueous dispersion, drying this aqueous dispersion by spreading it thinly across a film, and mold pressing the dried product obtained. The above-mentioned polishing part may have a crosslinked structure. The polishing body in the invention can be used favorably in a polishing pad and the like, for polishing the surface of a semiconductor wafer or the like.

REFERENCES:
patent: 6077581 (2000-06-01), Kuramochi et al.
patent: 6361403 (2002-03-01), Kuramochi et al.
patent: 2-262965 (1990-10-01), None
patent: 3-281172 (1991-12-01), None
patent: 5-222356 (1993-08-01), None
patent: 6-254769 (1994-09-01), None
patent: 8-294869 (1996-11-01), None
patent: 10-6231 (1998-01-01), None
patent: 10-329032 (1998-12-01), None
patent: 11-151659 (1999-06-01), None
patent: 11-188647 (1999-07-01), None
patent: 11-198045 (1999-07-01), None
patent: 2000-301461 (2000-10-01), None
patent: WO 99/24218 (1999-05-01), None
U.S. Appl. No. 11/288,086, filed Nov. 29, 2005, Hasegawa, et al.
U.S. Appl. No. 11/288,094, filed Nov. 29, 2005, Hasegawa, et al.

Affiliated with

Also associated with

Rating

Polishing body does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing body, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing body will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3768512