Polishing block heater

Details Polishing block heater Polishing block heater

1996-11-12

1998-06-23

Powell, William

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

156345, 216 88, 216 36, H01L 2100

Patent

active

057705224

ABSTRACT:
A method for mounting a semiconductor wafer on a polishing block to hold the semiconductor wafer during polishing. The method comprises the steps of providing a polishing block having a surface for mounting the semiconductor wafer and providing a heater comprising a heater body and a thermally conductive buffer plate which is selectively moveable with respect to the heater body between a pre-heating position in which the plate is spaced from the heater body and a heating position in which the plate contacts the heater body. A bonding agent is applied to the polishing block surface. The polishing block is placed on the buffer plate when the buffer plate is positioned in the pre-heating position and the buffer plate is moved from the pre-heating position to the heating position to heat the buffer plate, the polishing block and the bonding agent. The buffer plate is held in the heating position with the polishing block on the buffer plate for a period of time sufficient to prepare the bonding agent and the semiconductor wafer is applied to the prepared bonding agent.

REFERENCES:
patent: 3549439 (1970-12-01), Kaveggia
patent: 5032215 (1991-07-01), Dworak et al.
patent: 5348615 (1994-09-01), Gupta

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