Electrolysis: processes – compositions used therein – and methods – Electrolytic erosion of a workpiece for shape or surface...
Reexamination Certificate
2006-11-28
2006-11-28
King, Roy (Department: 1742)
Electrolysis: processes, compositions used therein, and methods
Electrolytic erosion of a workpiece for shape or surface...
C205S662000
Reexamination Certificate
active
07141155
ABSTRACT:
A polishing pad or other shaped article for the electrochemical mechanical polishing (ECMP) of a workpiece. The article includes an electrically-conductive compound which is formed into a layer. The compound is formulated as an admixture which includes a polymeric component forming a continuous phase in the layer, and an electrically-conductive filler component forming a discrete phase within the continuous phase. With the workpiece and the layer being electrically connected and with an electrical bias being applied between the workpiece and the layer, the bias being capable of activating an electrochemical reaction, the compound exhibits an overpotential for the activation of the reaction greater than the bias.
REFERENCES:
patent: 3760637 (1973-09-01), Budinger et al.
patent: 4198739 (1980-04-01), Budinger et al.
patent: 4588421 (1986-05-01), Payne
patent: 4728552 (1988-03-01), Jensen, Jr.
patent: 4752628 (1988-06-01), Payne
patent: 4765874 (1988-08-01), Modes et al.
patent: 4841680 (1989-06-01), Hoffstein et al.
patent: 4867757 (1989-09-01), Payne
patent: 4882024 (1989-11-01), Corrigan
patent: 4927432 (1990-05-01), Budinger et al.
patent: 4959113 (1990-09-01), Roberts
patent: 4964919 (1990-10-01), Payne
patent: 5230833 (1993-07-01), Romberger et al.
patent: 5257478 (1993-11-01), Hyde et al.
patent: 5264010 (1993-11-01), Brancaleoni et al.
patent: 5329734 (1994-07-01), Yu
patent: 5382272 (1995-01-01), Cook et al.
patent: 5389352 (1995-02-01), Wang
patent: 5391258 (1995-02-01), Brancaleoni et al.
patent: 5476606 (1995-12-01), Brancaleoni et al.
patent: 5480476 (1996-01-01), Cook et al.
patent: 5487697 (1996-01-01), Jensen
patent: 5489233 (1996-02-01), Cook et al.
patent: 5534053 (1996-07-01), Payne et al.
patent: 5578362 (1996-11-01), Reinhardt et al.
patent: 5605760 (1997-02-01), Roberts
patent: 5624303 (1997-04-01), Robinson
patent: 5645474 (1997-07-01), Kubo et al.
patent: 5664989 (1997-09-01), Nokata et al.
patent: 5693239 (1997-12-01), Wang et al.
patent: 5707492 (1998-01-01), Stager et al.
patent: 5738567 (1998-04-01), Manzonie et al.
patent: 5738800 (1998-04-01), Hosali et al.
patent: 5756398 (1998-05-01), Wang et al.
patent: 5769689 (1998-06-01), Cossaboon et al.
patent: 5770103 (1998-06-01), Wang et al.
patent: 5795218 (1998-08-01), Doan et al.
patent: 5807165 (1998-09-01), Uzoh et al.
patent: 5823855 (1998-10-01), Robinson
patent: 5860848 (1999-01-01), Loncki et al.
patent: 5876266 (1999-03-01), Miller et al.
patent: 5879222 (1999-03-01), Robinson
patent: 5882251 (1999-03-01), Berman et al.
patent: 5882723 (1999-03-01), Tsou
patent: 5900164 (1999-05-01), Budinger et al.
patent: 5911619 (1999-06-01), Uzoh et al.
patent: 5913713 (1999-06-01), Cheek et al.
patent: 5932486 (1999-08-01), Cook et al.
patent: 5938801 (1999-08-01), Robinson
patent: 5976000 (1999-11-01), Hudson
patent: 5989470 (1999-11-01), Doan et al.
patent: 6001269 (1999-12-01), Sethuraman et al.
patent: 6017265 (2000-01-01), Cook et al.
patent: 6019666 (2000-02-01), Roberts et al.
patent: 6022264 (2000-02-01), Cook et al.
patent: 6022268 (2000-02-01), Roberts et al.
patent: 6030899 (2000-02-01), Cook et al.
patent: 6036579 (2000-03-01), Cook et al.
patent: 6042741 (2000-03-01), Hosali et al.
patent: 6054017 (2000-04-01), Yang et al.
patent: 6062968 (2000-05-01), Sevilla et al.
patent: 6069080 (2000-05-01), James et al.
patent: 6071178 (2000-06-01), Baker, III
patent: 6074546 (2000-06-01), Sun et al.
patent: 6093649 (2000-07-01), Roberts et al.
patent: 6095902 (2000-08-01), Reinhardt
patent: 6099394 (2000-08-01), James et al.
patent: 6099954 (2000-08-01), Urbanavage et al.
patent: 6106754 (2000-08-01), Cook et al.
patent: 6117000 (2000-09-01), Anjur et al.
patent: 6120366 (2000-09-01), Lin et al.
patent: 6126532 (2000-10-01), Sevilla et al.
patent: 6132637 (2000-10-01), Hosali et al.
patent: 6143662 (2000-11-01), Rhoades et al.
patent: 6159088 (2000-12-01), Nakajima
patent: 6165904 (2000-12-01), Kim
patent: 6168508 (2001-01-01), Nagahara et al.
patent: 6171181 (2001-01-01), Roberts et al.
patent: 6174227 (2001-01-01), Ishikawa
patent: 6210254 (2001-04-01), Cook et al.
patent: 6210525 (2001-04-01), James et al.
patent: 6217418 (2001-04-01), Lukanc et al.
patent: 6217434 (2001-04-01), Roberts et al.
patent: 6218305 (2001-04-01), Hosali et al.
patent: 6231434 (2001-05-01), Cook et al.
patent: 6238271 (2001-05-01), Cesna
patent: 6241586 (2001-06-01), Yancey
patent: 6245679 (2001-06-01), Cook et al.
patent: 6261168 (2001-07-01), Jensen et al.
patent: 6267659 (2001-07-01), Chen et al.
patent: 6277015 (2001-08-01), Robinson et al.
patent: 6284114 (2001-09-01), Chechik et al.
patent: 6287174 (2001-09-01), Detzel et al.
patent: 6287185 (2001-09-01), Roberts et al.
patent: 6293852 (2001-09-01), Roberts et al.
patent: 6294473 (2001-09-01), Oliver
patent: 6299741 (2001-10-01), Sun et al.
patent: 6315645 (2001-11-01), Zhang et al.
patent: 6315857 (2001-11-01), Cheng et al.
patent: 6319370 (2001-11-01), Sun et al.
patent: 6325703 (2001-12-01), Cook et al.
patent: 6332832 (2001-12-01), Suzuki
patent: 6346032 (2002-02-01), Zhang et al.
patent: 6354915 (2002-03-01), James et al.
patent: 6358130 (2002-03-01), Freeman et al.
patent: 6358854 (2002-03-01), Fleming et al.
patent: 6364749 (2002-04-01), Walker
patent: 6368190 (2002-04-01), Easter et al.
patent: 6375559 (2002-04-01), James et al.
patent: 6379223 (2002-04-01), Sun et al.
patent: 6482307 (2002-11-01), Ashjaee et al.
patent: 2001/0000497 (2001-04-01), Epshteyn et al.
patent: 2001/0024878 (2001-09-01), Nakamura
patent: 2001/0031610 (2001-10-01), Budinger et al.
patent: 2001/0031615 (2001-10-01), Jensen et al.
patent: 2002/0028646 (2002-03-01), Jensen et al.
patent: 2002/0102853 (2002-08-01), Li et al.
patent: 2002/0119286 (2002-08-01), Chen et al.
patent: 2003/0045210 (2003-03-01), Kramer
patent: 2005/0133363 (2005-06-01), Hu et al.
patent: 1 103 346 (2001-05-01), None
patent: 1 112 816 (2001-07-01), None
patent: 0 919 330 (2002-02-01), None
patent: 1 361 023 (2003-11-01), None
patent: 07289442 (1995-11-01), None
patent: 09246709 (1997-09-01), None
patent: 09265998 (1997-09-01), None
patent: 09305884 (1997-11-01), None
patent: 09305885 (1997-11-01), None
patent: 10084230 (1998-03-01), None
patent: 10242900 (1998-08-01), None
patent: 10294459 (1998-10-01), None
patent: 11281153 (1999-01-01), None
patent: 11040226 (1999-02-01), None
patent: 11055246 (1999-03-01), None
patent: 11055684 (1999-03-01), None
patent: 11111126 (1999-04-01), None
patent: 11159839 (1999-06-01), None
patent: 11159841 (1999-06-01), None
patent: 11241636 (1999-08-01), None
patent: 2000134529 (2000-05-01), None
patent: 2000153142 (2000-05-01), None
patent: 98/47662 (1998-10-01), None
patent: 00/02707 (2000-01-01), None
patent: 00/71297 (2000-11-01), None
patent: 01/19567 (2001-03-01), None
patent: 01/24969 (2001-04-01), None
patent: 01/49449 (2001-07-01), None
patent: 01/63018 (2001-08-01), None
patent: 01/71796 (2001-09-01), None
patent: 02/13248 (2002-02-01), None
patent: 02/075804 (2002-09-01), None
patent: 02/084714 (2002-10-01), None
patent: 02/085570 (2002-10-01), None
Davis et al., ASM Handbook, 1992, ASM International, vol. 2, 518-519.
Article from Jul. 2002 Semiconductor Magazine entitled Chemical Mechanical Planar by Katherine Derbyshire.
Prismark Partners LLC entitled Chemical Mechanical Polishing, dated Nov. 2000.
Prismark Partners LLC entitled The Semiconductor Equipment Business, dated Mar. 2000.
Bunyan Michael H.
Clement Thomas A.
Hannafin John J.
LaRosee Marc E.
Young Kent M.
Alexander Michael P.
King Roy
Molnar, Jr. John A.
Parker-Hannifin Corporation
LandOfFree
Polishing article for electro-chemical mechanical polishing does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Polishing article for electro-chemical mechanical polishing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing article for electro-chemical mechanical polishing will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3689536