Polishing apparatus with indexing wafer processing stations

Details Polishing apparatus with indexing wafer processing stations Polishing apparatus with indexing wafer processing stations

1994-12-08

1997-07-22

Rose, Robert A.

Abrading

Machine

Rotary tool

451 66, B24B 722

Patent

active

056498543

ABSTRACT:
Apparatus for polishing a side of a thin, flat wafer of a semiconductor material includes first and second polishing heads which each hold a wafer against a wetted polishing surface and which each rotate and oscillate its respective wafer over the polishing surface. When the first polishing head is moved away from the polishing surface to clean, eject, and replace its wafer, the second polishing head occupies the space over the polishing surface normally occupied by the first polishing head so that the polishing surface is used substantially continuously, and not intermittently.

REFERENCES:
patent: 3849944 (1974-11-01), Noll
patent: 4753049 (1988-06-01), Mori
patent: 5140774 (1992-08-01), Ohodera
patent: 5174067 (1992-12-01), Hasegawa et al.
patent: 5333413 (1994-08-01), Hashimoto
patent: 5361545 (1994-11-01), Nakamura

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