Polishing apparatus, polishing method, and processing apparatus

Details Polishing apparatus, polishing method, and processing apparatus Polishing apparatus, polishing method, and processing apparatus

2007-10-02

2011-11-01

Nguyen, Dung Van (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S008000, C451S044000, C451S311000

Reexamination Certificate

active

08047896

ABSTRACT:
The present invention provides a polishing apparatus and a polishing method capable of calculating outside diameters of rolls of a polishing tape on a polishing-tape supply reel and a polishing-tape recovery reel and capable of calculating a remaining amount of the polishing tape and a consumption of the polishing tape from the outside diameters of the rolls. This polishing apparatus includes a polishing-tape supply reel (46), a polishing head (44), a polishing-tape drawing-out mechanism G1, and a polishing-tape supply and recovery mechanism (45) configured to recover the polishing tape (43) from the polishing-tape supply reel (46) via the polishing head (44). The polishing-tape supply and recovery mechanism (45) includes a motor Mb adapted to apply a torque to the polishing-tape supply reel (46) so as to exert a predetermined tension on the polishing tape (43) traveling through the polishing head (44), and a rotation angle detector REa adapted to detect a rotation angle of the polishing-tape supply reel (46).

REFERENCES:
patent: 5951384 (1999-09-01), Morioka et al.
patent: 7066787 (2006-06-01), Nakanishi et al.
patent: 7108582 (2006-09-01), Sato et al.
patent: 7682225 (2010-03-01), Hongo et al.
patent: 62-213955 (1987-09-01), None
patent: 62-215845 (1987-09-01), None
patent: 63-2661 (1988-01-01), None
patent: 3-131464 (1991-06-01), None
patent: 2003-240673 (2003-08-01), None
patent: 2006/112531 (2006-10-01), None
International Search Report mailed Dec. 25, 2007 for International Application No. PCT/JP2007/069641.

Affiliated with

Also associated with

Rating

Polishing apparatus, polishing method, and processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing apparatus, polishing method, and processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing apparatus, polishing method, and processing apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4304807