Polishing apparatus of semiconductor wafer

Abrading – Precision device or process - or with condition responsive... – Controlling temperature

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451 41, 451 53, 451259, 451288, 451388, B24B 4900

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active

056054882

ABSTRACT:
A plurality of cells are provided in a concave portion of a top plate. A cloth to which water is penetrated is provided in a back face of each cell, and a wafer is attracted by the cloth. First and second pipes are connected to each cell. The first pipe introduces liquid to the cell, and the second pipe discharges liquid from the cell, and guides liquid to the first pipe. A constant-temperature device is provided to each first pipe, and a temperature of liquid of each cell is adjusted by the constant-temperature device in accordance with a temperature distribution of the wafer. Whereby, a polishing rate of each part of the wafer can be equalized.

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