Polishing apparatus having retainer ring rounded along outer per

Details Polishing apparatus having retainer ring rounded along outer per Polishing apparatus having retainer ring rounded along outer per

1996-11-07

1999-08-31

Morgan, Eileen P.

Abrading

Machine

Rotary tool

451285, 451398, B24B 500

Patent

active

059445904

ABSTRACT:
A polishing apparatus has a retainer for retaining a semiconductor wafer on a polishing pad, and the outer periphery of the retainer ring is rounded so as to minimize a deformation produced in the polishing pad, thereby improving the surface profile of the semiconductor wafer.

REFERENCES:
patent: 5084071 (1992-01-01), Nenadic et al.
patent: 5573448 (1996-11-01), Nakazima
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5643053 (1997-07-01), Shendon
patent: 5645474 (1997-07-01), Kubo et al.
patent: 5651724 (1997-07-01), Kimura et al.
patent: 5664989 (1997-09-01), Nakata et al.
patent: 5679065 (1997-10-01), Henderson
patent: 5749771 (1998-05-01), Isobe
"The Effect of the Pad Dressing on the Interlayer Dielectric Film CMP", The Proceedings of 42 Spring Meeting of Japan Applied Physics, p. 788, No. 30p-C-16.

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