Polishing apparatus having interlock function

Details Polishing apparatus having interlock function Polishing apparatus having interlock function

1997-05-30

1999-05-18

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

Computer controlled

451 9, 451 41, 451 21, 451287, 36447417, 36447406, B24B51/00

Patent

active

059046082

ABSTRACT:
A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus has an interlock function includes a turntable having a polishing surface thereon, a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the turntable, a first motor for rotating the turntable, and a second motor for rotating the top ring. The polishing apparatus further comprises a first actuator for lifting and lowering the top ring, a second actuator for moving the top ring in a horizontal direction, and a control unit for controlling the motors and the actuators. The control unit controls the motors and the actuators in such a manner that when an abnormality is detected in at least one of the motors and the actuators, at least one of the motors and the actuators other than that of the abnormality performs a predetermined operation.

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IEEE Technical Paper In Situ CMP Monitoring Technique for Multi-layer Interconnection by Fukuroda et al, 1995.

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