Polishing apparatus for semiconductor wafers

Details Polishing apparatus for semiconductor wafers Polishing apparatus for semiconductor wafers

1999-03-16

2000-07-04

Rose, Robert A.

Abrading

Machine

Rotary tool

451398, 451388, B24B 722

Patent

active

060830905

ABSTRACT:
A polishing apparatus for uniformly polishing the whole of a target surface of a semiconductor wafer includes a wafer holder for holding a wafer by adsorption and a pad to which the wafer holder is compressed while rotating. Between a rotary shaft for the apparatus and the wafer holder is a mechanism for allowing the orientation of the wafer holder to change with an increased degree of freedom. This mechanism is formed with a container filled with a liquid and attached to the lower end of the rotary shaft and an elastic member which seals the liquid in the container.

REFERENCES:
patent: 4897966 (1990-02-01), Takahashi
patent: 5081795 (1992-01-01), Tanaka et al.
patent: 5443416 (1995-08-01), Volodarsky et al.

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