Polishing apparatus for notch portion of wafer

Details Polishing apparatus for notch portion of wafer Polishing apparatus for notch portion of wafer

1994-06-27

1995-07-04

Lavinder, Jack W.

Abrading

Machine

Rotary tool

451388, 451414, 451366, 451387, B24B 1900

Patent

active

054295440

ABSTRACT:
An polishing apparatus which can effectively polish a bottom wall of a wafer in a notch portion is disclosed. The apparatus includes: a table for supporting the wafer thereon; a rotary buff having a thickness so that the periphery thereof can enter the notch portion of the wafer, and is rotated around an axis which is parallel with a plane of the surface of the wafer supported on the table; a first rotating member such as a motor for rotating the rotary buff; a linkage for supporting the rotary buff; an adjusting member such as a cylinder device for adjusting the pressure applied to the bottom wall of the wafer in the notch portion from the rotary buff; and a second rotating member for turning the table around a predetermined axis which is approximately parallel with the rotary axis of the rotary buff so that the applied pressure from the rotary buff acts on the bottom wall of the wafer in the notch portion in a direction approximately perpendicular to the surface of the bottom wall.

REFERENCES:
patent: 1220287 (1917-03-01), Styll
patent: 2275483 (1942-03-01), Parker
patent: 4174592 (1978-11-01), Bernhardt
patent: 5185965 (1993-02-01), Ozaki
patent: 5271185 (1993-12-01), Hosokawa

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